Search Results
Chapter
Low temperature bonding of high density large area array interconnects for 3D integration
November 01, 2010
Chapter
Fabrication of TSV-based silicon interposers
November 01, 2010
Chapter
High Density Interconnect at 10µm pitch with Mechanically Keyed Cu/Sn-Cu and Cu-Cu Bonding for 3-D Integration
June 01, 2010
Chapter
Reliability and Ultra-Low Temperature Bonding of High Density Large Area Arrays with Cu/Sn-Cu Interconnects for 3D Integration
June 01, 2010
Chapter
Integrated process for defect-free copper plating and chemical-mechanical polishing of through-silicon vias for 3D interconects
June 01, 2010
Chapter
Recent advances in interconnect bonding for 3-D ntegration of high density area arrays
May 01, 2010
Article
Multispectral UV-Vis-IR imaging using low-cost quantum dot technology
April 01, 2010