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High Density Interconnect at 10µm pitch with Mechanically Keyed Cu/Sn-Cu and Cu-Cu Bonding for 3-D Integration
Reed, J., Lueck, M., Gregory, C., Huffman, A., Lannon, J., & Temple, D. (2010). High Density Interconnect at 10µm pitch with Mechanically Keyed Cu/Sn-Cu and Cu-Cu Bonding for 3-D Integration. In 60th ECTC Conference Proceedings (pp. 500 - 507)
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