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Recent advances in interconnect bonding for 3-D ntegration of high density area arrays
Lannon, J., Gregory, C., Lueck, M., Huffman, C., Temple, D., Moll, A., & Knowlton, W. (2010). Recent advances in interconnect bonding for 3-D ntegration of high density area arrays. In Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV (pp. 766305 - 1 -7)
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