Recent advances in interconnect bonding for 3-D ntegration of high density area arrays

Charles A. Huffman; John M. Lannon; Dorota S. Temple; Matthew R. Lueck; Christopher W. Gregory; John M. Lannon; Christopher W. Gregory; Matthew R. Lueck; Charles Alan Huffman; Dorota S. Temple; A Moll; W Knowlton

Recent advances in interconnect bonding for 3-D ntegration of high density area arrays

Lannon, J., Gregory, C., Lueck, M., Huffman, C., Temple, D., Moll, A., & Knowlton, W. (2010). Recent advances in interconnect bonding for 3-D ntegration of high density area arrays. In Technologies for Synthetic Environments: Hardware-in-the-Loop Testing XV (pp. 766305 - 1 -7)

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