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Low temperature bonding of high density large area array interconnects for 3D integration
Lannon, J., Reed, J., Lueck, M., Gregory, C., Huffman, A., & Temple, D. (2010). Low temperature bonding of high density large area array interconnects for 3D integration. In IMAPS 2010 - 43rd International Symposium on Microelectronics (pp. 000028 - 000035)
