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Chapter
Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration
December 01, 2009
Chapter
High density Cu-Cu nterconnect bonding for 3-D integration
May 01, 2009
Chapter
Optimization of electrolyte chemistry and process parameters for void-free copper electroplating of high aspect ratio through-silicon vias for 3D Integration
May 01, 2009
Article
Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration
March 01, 2009
Chapter
Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration
March 01, 2009