Optimization of electrolyte chemistry and process parameters for void-free copper electroplating of high aspect ratio through-silicon vias for 3D Integration

Dean M. Malta; Dorota S. Temple; Christopher W. Gregory; Dean M. Malta; Christopher W. Gregory; Dorota S. Temple; Chen Wang; Thomas Richardson; Yun Zhang

Optimization of electrolyte chemistry and process parameters for void-free copper electroplating of high aspect ratio through-silicon vias for 3D Integration

Malta, D., Gregory, C., Temple, D., Wang, C., Richardson, T., & Zhang, Y. (2009). Optimization of electrolyte chemistry and process parameters for void-free copper electroplating of high aspect ratio through-silicon vias for 3D Integration. In Electronic Components and Technology Conference, 59th (pp. 1301 - 1306)

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