Search Results
Chapter
Characterization and Failure Analysis of TSV Interconnects: From Non-destructive Defect Localization to Material Analysis with Nanometer Resolution
June 01, 2011
Chapter
Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs
May 01, 2011
Chapter
Vias-last process technology for thick 2.5D Si interposers
January 01, 2012
Chapter
3-D integration technology platforms for high performance mixed-signal applications
April 01, 2011
Article
The key to low temperature bonding for 3D integration
September 01, 2011
Chapter
High resolution acoustical imaging of high-density-interconnects for 3D integration
June 01, 2011
Article
Extending acoustic microscopy for comprehensive failure analysis applications
October 01, 2011
Article
Superfilling technology: Transferring knowledge to industry from the National Institute of Standards and Technology
February 01, 2011
Article
Superfilling Technology: Transferring Knowledge to Industry from the National Institute of Standards and Technology
February 01, 2011
Book
Viewing America's energy future in three dimensions
June 17, 2011
Chapter
Acoustic Inspection of High-Density-Interconnects for 3D-Integration
October 01, 2011
Article
High density metal-metal interconnect bonding for 3D integration
January 01, 2012
News Release
New Monograph Addresses Need for Energy Behavior Research
July 06, 2011