Search Results
Chapter
Characterization and Failure Analysis of TSV Interconnects: From Non-destructive Defect Localization to Material Analysis with Nanometer Resolution
June 01, 2011
Chapter
Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs
May 01, 2011
Chapter
Vias-last process technology for thick 2.5D Si interposers
January 01, 2012
Chapter
3-D integration technology platforms for high performance mixed-signal applications
April 01, 2011
Article
The key to low temperature bonding for 3D integration
September 01, 2011
Chapter
High resolution acoustical imaging of high-density-interconnects for 3D integration
June 01, 2011
Article
Extending acoustic microscopy for comprehensive failure analysis applications
October 01, 2011
Article
Superfilling technology: Transferring knowledge to industry from the National Institute of Standards and Technology
February 01, 2011
Article
Superfilling Technology: Transferring Knowledge to Industry from the National Institute of Standards and Technology
February 01, 2011
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Book
Viewing America's energy future in three dimensions
June 17, 2011
Chapter
Acoustic Inspection of High-Density-Interconnects for 3D-Integration
October 01, 2011
Article
High density metal-metal interconnect bonding for 3D integration
January 01, 2012
News Release
New Monograph Addresses Need for Energy Behavior Research
July 06, 2011