Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs

Dean M. Malta; Dorota S. Temple; Matthew R. Lueck; Christopher W. Gregory; Dean M. Malta; Christopher W. Gregory; Matthew R. Lueck; Dorota S. Temple; Michael Krause; Frank Altmann; Matthias Petzold; Michael Weatherspoon; Joshua Miller

Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs

Malta, D., Gregory, C., Lueck, M., Temple, D., Krause, M., Altmann, F., Petzold, M., Weatherspoon, M., & Miller, J. (2011). Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs. In Proc. of 61st Electronic Components and Technology Conference (pp. 1815 - 1821)

Copy citation