RTI uses cookies to offer you the best experience online. By clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.
3-D integration technology platforms for high performance mixed-signal applications
Temple, D., Malta, D., Vick, E., Lannon, J., Reed, J., & Huffman, A. (2011). 3-D integration technology platforms for high performance mixed-signal applications. In Proceedings of the Government Microcircuit Applications and Critical Technology Conference, GOMACTech-11 (pp. 93 - 96)