Dorota Temple

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Minicolumn Silicon Field-Emitter Arrays

Wafer-level vacuum packaging of smart sensors

Spin-dependent electrical transport in ion-beam sputter deposited Fe-Cr multilayers

Selective Epitaxial-Growth of Silicon by the Ac Technique .3. Lateral Overgrowth Structures

High Density Metal-Metal Interconnect Bonding with Pre-Applied Fluxing Underfill

High Density Interconnect at 10µm pitch with Mechanically Keyed Cu/Sn-Cu and Cu-Cu Bonding for 3-D Integration

Selective area chemical vapor deposition of Si1-xGex thin film alloys by the alternating cyclic method: Experimental data II. Morphology and composition as a function of deposition parameters

Extraordinary Hall effect in Fe-Cr giant magnetoresistive multilayers

PbS CQD device performance and modeling

Comparative study of Ni nanowires patterned by electron-beam lithography and fabricated by lift-off and dry etching techniques

Chemical Vapor-Deposition of Copper from Copper (Ii) Hexafluoroacetylacetonate

Characterization and Failure Analysis of TSV Interconnects: From Non-destructive Defect Localization to Material Analysis with Nanometer Resolution

High-efficiency thin-film superlattice thermoelectric cooler modules enabled by low resistivity contacts

Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs

Colloidal quantum dot Vis-SWIR imaging: demonstration of a focal plane array and camera prototype

Electromechanics of a highly flexible transparent conductor for display applications

Planar PbS quantum dot/C-60 heterojunction photovoltaic devices with 5.2% power conversion efficiency

Processing techniques for InGaAs/InAlAs/InGaAs spin field effect transistors

Field emission from coated silicon field emitter arrays

Advanced Processing Techniques for Through-wafer Interconnects