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High Density Metal-Metal Interconnect Bonding with Pre-Applied Fluxing Underfill
Gregory, C., Lueck, M., Huffman, A., Lannon, J., & Temple, D. (2012). High Density Metal-Metal Interconnect Bonding with Pre-Applied Fluxing Underfill. In Proceedings of the 62nd IEEE Electronic Components and Technology Conference, ECTC 2012 (pp. 20 - 25)
