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Article
Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization
January 01, 2014
Chapter
High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 micron pitch
October 02, 2013
Chapter
Low Cost Uncooled VOx Infrared Camera Development
October 01, 2013
Chapter
Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs
May 01, 2013
Chapter
Characterization and modeling of copper TSVs for silicon interposers
May 01, 2013
Chapter
High-density 3-D IC integration technology for mixed-signal microsystems
March 11, 2013
Chapter
High Density 3-D Integration Technology for Mixed-Signal Microsystems
March 01, 2013
Patent
Die bonding utilizing a patterned adhesion layer
January 29, 2013