High Density 3-D Integration Technology for Mixed-Signal Microsystems

John M. Lannon; Dean M. Malta; Dorota S. Temple; Erik P. Vick; Matthew R. Lueck; Dorota S. Temple; Matthew R. Lueck; Erik P. Vick; Dean M. Malta; John M. Lannon

High Density 3-D Integration Technology for Mixed-Signal Microsystems

Temple, D., Lueck, M., Vick, E., Malta, D., & Lannon, J. (2013). High Density 3-D Integration Technology for Mixed-Signal Microsystems. In Proc. of 2013 Government Microcircuit Applications & Critical Technology Conference (GOMACTech 2013) (pp. 1 - 3)

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