Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs

Charles A. Huffman; John M. Lannon; Dean M. Malta; Dorota S. Temple; Matthew R. Lueck; Christopher W. Gregory; Marianne Trexler Butler; Matthew R. Lueck; Dean M. Malta; Charles Alan Huffman; Christopher W. Gregory; Marianne Trexler Butler; John M. Lannon; Dorota S. Temple

Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs

Lueck, M., Malta, D., Huffman, A., Gregory, C., Butler, M., Lannon, J., & Temple, D. (2013). Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs. In Proc. 63rd IEEE Electronic Component and Technology Conference (pp. 317 - 322)

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