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Search Results

Showing results 21 to 40 of 174.

Chapter

RTI CircuitFilm(TM) Technology for Implementing High-Performance COTS ICs in Flexible Hybrid Electronics

March 01, 2017
Article

Wafer-level vacuum packaging of smart sensors

November 01, 2016
Chapter

Wafer-Level Vacuum Packaging of Microbolometer-Based Infrared Imagers

October 24, 2016
Chapter

Towards low-cost infrared imagers: how to leverage Si IC ecosystem

October 21, 2016
Chapter

Highly Integrated Thermoelectric Coolers

June 01, 2016
Patent

Electronic Devices Utilizing Contact Pads with Protrusions and Methods for Fabrication

February 09, 2016
Chapter

Colloidal quantum dot Vis-SWIR imaging: demonstration of a focal plane array and camera prototype

August 01, 2015
Chapter

Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test

June 01, 2015
Patent

Three dimensional interconnect structure and method thereof

March 10, 2015
Article

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10 µm for infrared focal plane array applications

March 01, 2015
Article

Advances in three-dimensional integration technologies in support

February 01, 2015
Article

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10um for infrared focal plane array applications

January 01, 2015
Chapter

Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test

December 01, 2014
Patent

Faraday cup array integrated with a readout IC and method for manufacture thereof

October 21, 2014
Chapter

High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 µm pitch

October 01, 2014
Chapter

Low-cost SWIR sensors: Advancing the performance of ROIC-integrated colloidal quantum dot photodiode arrays

June 01, 2014
Chapter

Process integration, improvements, and testing of Si interposers for embedded computing applications

May 27, 2014
Chapter

Demonstration of low cost TSV fabrication in thick silicon wafers

May 01, 2014
Article

Enabling more capability within smaller pixels: advanced wafer-level process technologies for integration of focal plane arrays with readout electronics (invited paper)

May 01, 2014
Article

Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

January 01, 2014