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High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 µm pitch
Lueck, M., Gregory, C., Malta, D., Huffman, A., Lannon, J., & Temple, D. (2014). High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 µm pitch. In Proceedings of the 2013 IEEE International 3D Systems Integration Conference (pp. 1 - 5)
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