RTI uses cookies to offer you the best experience online. By clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.

Search Results

Search Results

EXPERT

Dorota Temple

Showing results 21 to 40 of 190.

Article

Advanced Processing Techniques for Through-wafer Interconnects

January 01, 2004
Patent

Closed-loop cold cathode current regulator

May 21, 2002
Chapter

Low-cost SWIR sensors: Advancing the performance of ROIC-integrated colloidal quantum dot photodiode arrays

June 01, 2014
Article

Surface anisotropy energy of thin amorphous magnetic films of (Gd1?xCox)1?yMoy alloys; experimental results

January 01, 1985
Chapter

Demonstration of low cost TSV fabrication in thick silicon wafers

May 01, 2014
Article

An alternative derivation for the equilibrium constant of binary solid solution-vapor systems

January 01, 1999
Article

Selective-Area Chemical-Vapor-Deposition of Silicon by the Alternating Cyclic Method - A Thermodynamic Analysis

January 01, 1994
Article

Ion beam deposited GMR materials

January 01, 2002
Patent

Faraday cup array integrated with a readout IC and method for manufacture thereof

October 21, 2014
Chapter

High density Cu-Cu nterconnect bonding for 3-D integration

May 01, 2009
Article

Planarization processes and applications III. As-deposited and annealed film properties

January 01, 2000
Article

Differences in Surface Erosion of Silicon-Wafers Annealed in Si-Loaded, Sic-Coated and Pure Sic Carriers

January 01, 1991
Article

Cu Cvd from Copper(Ii) Hexafluoroacetylacetonate: 1. A Cold-Wall Reactor Design, Blanket Growth-Rate, and Natural Selectivity

January 01, 1995
Chapter

Low temperature metal and polymer bonding for advanced infrared imaging sensors

May 22, 2012
Article

Surface modes in magnetic thin amorphous films of GdCoMo alloys

June 01, 1983
Chapter

Highly Integrated Thermoelectric Coolers

June 01, 2016
Chapter

Recent advances in interconnect bonding for 3-D ntegration of high density area arrays

May 01, 2010
Patent

Electronic package with three-dimensional conductive planes, and methods for fabrication

January 30, 2018
Article

Cu Cvd from Copper(Ii) Hexafluoroacetylacetonate: 2. Laser-Assisted Selective-Area Deposition

January 01, 1995
Article

Influence of oxygen vacancy concentration on electrical resistivity in EuO1?x

September 14, 1985