Search Results
Article
Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10um for infrared focal plane array applications
January 01, 2015
Chapter
Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test
December 01, 2014
Patent
Faraday cup array integrated with a readout IC and method for manufacture thereof
October 21, 2014
Chapter
High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 µm pitch
October 01, 2014
Chapter
Low-cost SWIR sensors: Advancing the performance of ROIC-integrated colloidal quantum dot photodiode arrays
June 01, 2014
Chapter
Process integration, improvements, and testing of Si interposers for embedded computing applications
May 27, 2014
Chapter
Demonstration of low cost TSV fabrication in thick silicon wafers
May 01, 2014
Article
Enabling more capability within smaller pixels: advanced wafer-level process technologies for integration of focal plane arrays with readout electronics (invited paper)
May 01, 2014