RTI uses cookies to offer you the best experience online. By clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.
Vias-last process technology for thick 2.5D Si interposers
Vick, E., Goodwin, S., Cunningham, G., & Temple, D. (2012). Vias-last process technology for thick 2.5D Si interposers. In 3D Systems Integration Conference (3DIC), 2011 IEEE International (pp. 1 - 4)
