RTI uses cookies to offer you the best experience online. By clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.
Pendeo-epitaxy (TM) process for aluminum gallium nitride thin films on silicon carbide substrates via metalorganic chemical vapor deposition
Gehrke, T., Lenthicum, KJ., Rajagopal, P., Preble, EA., Carlson, EP., Robin, BM., & Davis, RF. (2000). Pendeo-epitaxy (TM) process for aluminum gallium nitride thin films on silicon carbide substrates via metalorganic chemical vapor deposition. In CH. Carter, RP. Devaty, & GS. Rohrer (Eds.), Silicon Carbide and Related Materials-1999 Parts 1 & 2 (pp. 1491-1494). TRANS TECH PUBLICATIONS LTD.
Pendeo-epitaxial growth of AlxGa1-xN thin films has been achieved on stripes etched in a GaN seed layer on 6H-SiC(0001) substrates using metallorganic vapor phase epitaxy. Fully coalesced thin films have been characterized for a comparison study with conventional grown AlxGa1-xN thin films using scanning electron microscopy, X-ray diffraction, and high resolution scanning Auger microprobe. A FWHM of 794 arcsec has been measured for pendeo-epitaxially grown Al10Ga90N films, which is comparable to conventional grown films on 2H-AlN/6H-SiC substrate. A variation of 1% in the atomic Al content of Al10Ga90N thin films related to the microstructure has been measured.