RTI uses cookies to offer you the best experience online. By clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.
Microstructure of nonpolar a-plane GaN grown on (1120) 4H-SiC investigated by TEM.
Zakharov, DN., Liliental-Weber, Z., Wagner, B., Reitmeier, Z., Preble, EA., & Davis, RF. (2003). Microstructure of nonpolar a-plane GaN grown on (1120) 4H-SiC investigated by TEM. In HM. Ng, M. Wraback, K. Hiramatsu, & N. Grandjean (Eds.), GAN and Related Alloys-2003 (pp. 747-752). Chinese Materials Research Society.
Plan-view and cross-section samples of (1120) (a-plane) GaN grown on 4H-SiC substrates with AlN buffer layers were studied by transmission electron microscopy. Samples reveal the presence of a high density of stacking faults formed on the basal plane of hexagonal GaN. These stacking faults, terminated in the growth plane by threading dislocations, nucleate at the AlN/4H-SiC interface and propagate to the GaN layer surface. High resolution electron microscopy shows that the majority of stacking faults are low-energy planar defects of the type I-1 and I-2. High energy stacking faults (E) are not observed.