Fan-out packaging of microdevices assembled using micro-transfer-printing

Charles A. Huffman; John M. Lannon; Matthew R. Lueck; Paul Francis Hines; Christopher A. Bower; Matthew R. Lueck; Charles Alan Huffman; Paul Francis Hines; John M. Lannon; Sal Bonafede; A. Trindade; Christopher A. Bower

Fan-out packaging of microdevices assembled using micro-transfer-printing

Lueck, M., Huffman, A., Hines, P., Lannon, J., Bonafede, S., Trindade, A., & Bower, C. (2016). Fan-out packaging of microdevices assembled using micro-transfer-printing. In Proceedings of the 66th Electronic Components and Technology Conference (ECTC 2016) (pp. 37 - 42)

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