RTI uses cookies to offer you the best experience online. By clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.
Development of wafer-scale cooling/heating thermoelectric arrays using thin-film superlattice devices
Alley, R., Coonley, K., Addepalli, P., Siivola, E., Mantini, M., & Venkatasubramanian, R. (2008). Development of wafer-scale cooling/heating thermoelectric arrays using thin-film superlattice devices. In Proceedings ICT '02. Twenty-First International Conference on Thermoelectrics, 25-29 Aug 2002 (pp. 528-530) http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1190371
Thin-film superlattice thermoelectric material was used to fabricate 2-inch wafer scale thermoelectric module arrays. These arrays employ a promising thermoelectric device technology that exhibits a significant enhancement in the thermoelectric device figure of merit (ZT) at 300 K, cooling/heating power densities in excess of 100 Watts/cm2, and response times significantly faster than bulk devices. To power and characterize these devices, we have developed a high-speed computer controlled multi-channel power supply with integrated real-time infrared imaging. This system allows creation of individual temperature control profiles, and exploits the rapid response time of the thin-film device. Using this system, we demonstrate high-speed operation and compare the response times of bulk and thin-film devices in the same format. Finally, applications of thin-film thermoelectric arrays are considered.