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Characterization and Failure Analysis of TSV Interconnects
From Non-destructive Defect Localization to Material Analysis with Nanometer Resolution
Krause, M., Altmann, F., Schmidt, C., Petzold, M., Malta, D., & Temple, D. (2011). Characterization and Failure Analysis of TSV Interconnects: From Non-destructive Defect Localization to Material Analysis with Nanometer Resolution. In Proc. of the 61st Electronic Component and Technology Conference, ECTC 2011 (pp. 1452 - 1458)
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