Characterization and Failure Analysis of TSV Interconnects: From Non-destructive Defect Localization to Material Analysis with Nanometer Resolution

Dean M. Malta; Dorota S. Temple; Michael Krause; Frank Altmann; Christian Schmidt; Matthias Petzold; Dean M. Malta; Dorota S. Temple

Characterization and Failure Analysis of TSV Interconnects

From Non-destructive Defect Localization to Material Analysis with Nanometer Resolution

Krause, M., Altmann, F., Schmidt, C., Petzold, M., Malta, D., & Temple, D. (2011). Characterization and Failure Analysis of TSV Interconnects: From Non-destructive Defect Localization to Material Analysis with Nanometer Resolution. In Proc. of the 61st Electronic Component and Technology Conference, ECTC 2011 (pp. 1452 - 1458)

Copy citation