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3D and 2.5D packaging assembly with highly silica filled One Step Chip Attach Materials for both thermal compression bonding and mass reflow processes
Duffy, D., Gregory, C., Breach, C., & Huffman, A. (2014). 3D and 2.5D packaging assembly with highly silica filled One Step Chip Attach Materials for both thermal compression bonding and mass reflow processes. In Electronic Components and Technology Conference, 2014 IEEE 64th (pp. 1803 - 1809)