Services and Capabilities
Collaborating to develop custom microfabrication, interconnect, packaging, and electronics integration solutions for advanced and low-volume applications
From advanced interconnect and packaging technologies to microstructure fabrication and packaging, we work with our partners to help clients realize the next-generation electronic systems they need. Our extended team employs advanced wafer-level packaging, 2.5D and 3D integration technologies, and novel microfabrication, assembly, and integration capabilities that enable higher-performance systems with decreased size, weight, and power.
A state-of-the-art microfabrication facility supports development, flexible prototyping, and small-volume product runs of high-performance sensor and actuator arrays, biomedical devices, high-performance computing, and other technologies. With our partners, we also support ITAR applications and offer a "safe harbor" development environment to our clients.
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Dorota Temple
Dorota Temple
Related Projects
Quilt Packaging Technology for Virtually Seamless Chip-to-Chip Connection and Precision Alignment
Advanced integrated circuit technology to enable large imaging and display systems