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Article
Wafer-level vacuum packaging of smart sensors
November 01, 2016
Impact
Thin-Film Electric Coolers for Thermal Management in Electronic Components
April 19, 2016
Chapter
Highly Integrated Thermoelectric Coolers
June 01, 2016
Patent
Electronic Devices Utilizing Contact Pads with Protrusions and Methods for Fabrication
February 09, 2016
Chapter
Towards low-cost infrared imagers: how to leverage Si IC ecosystem
October 21, 2016
Chapter
Wafer-Level Vacuum Packaging of Microbolometer-Based Infrared Imagers
October 24, 2016