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A semiconductor device and method of fabricating the device. An
emitter region is formed self centered and self aligned
symmetrically with a base region. Using frontside processing
techniques, a collector is formed symmetrically self-aligned with
the base region and the emitter region. The collector region may be
further formed self-centered with the base region using backside
processing techniques. The self-aligned and self-centered symmetric
structure virtually eliminates parasitic elements in the device
significantly improving the device performance. The device is
scalable on the order of approximately 0.1 microns. The method also
provides reproduceability and repeatability of device
characteristics necessary for commercial manufacture of the
symmetric device.