RTI uses cookies to offer you the best experience online. By clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.
A remote plasma enhanced CVD apparatus and method for growing
semiconductor layers on a substrate, wherein a intermediate feed
gas, which does not itself contain constituent elements to be
deposited, is first activated in an activation region to produce
plural reactive species of the feed gas. These reactive species are
then spatially filtered to remove selected of the reactive species,
leaving only other, typically metastable, species which are then
mixed with a carrier gas including constituent elements to be
deposited on the substrate. During this mixing, the selected
spatially filtered reactive species of the feed gas chemically
interacts, i.e., partially dissociates and activates, in the gas
phase, the carrier gas, with the process variables being selected
so that there is no back-diffusion of gases or reactive species
into the feed gas activation region. The dissociated and activated
carrier gas along with the surviving reactive species of the feed
gas then flows to the substrate. At the substrate, the surviving
reactive species of the feed gas further dissociate the carrier gas
and order the activated carrier gas species on the substrate
whereby the desired epitaxial semiconductor layer is grown on the
substrate.