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Reliability and Ultra-Low Temperature Bonding of High Density Large Area Arrays with Cu/Sn-Cu Interconnects for 3D Integration
Reed, J., Lueck, M., Gregory, C., Huffman, A., Lannon, J., & Temple, D. (2010). Reliability and Ultra-Low Temperature Bonding of High Density Large Area Arrays with Cu/Sn-Cu Interconnects for 3D Integration. In 13th IEEE IITC Conference (pp. 1 - 3)
