Process Integration and Testing of TSV Si Interposers for 3D Integration Applications

Scott H. Goodwin; Charles A. Huffman; John M. Lannon; Dean M. Malta; Dorota S. Temple; Erik P. Vick; Matthew R. Lueck; Christopher W. Gregory; Jeffery Allan Hilton; Garry Brian Cunningham; John M. Lannon; Jeffery Allan Hilton; Charles Alan Huffman; Matthew R. Lueck; Erik P. Vick; Scott H. Goodwin; Garry Brian Cunningham; Dean M. Malta; Christopher W. Gregory; Dorota S. Temple

Process Integration and Testing of TSV Si Interposers for 3D Integration Applications

Lannon, J., Hilton, J., Huffman, A., Lueck, M., Vick, E., Goodwin, S., Cunningham, G., Malta, D., Gregory, C., & Temple, D. (2012). Process Integration and Testing of TSV Si Interposers for 3D Integration Applications. In Proc. 62th IEEE Electronic Component and Technology Conference, ECTC 2012 (pp. 268 - 273)

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