RTI uses cookies to offer you the best experience online. By clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.
LaBennett, R., Bonafede, S., Hoffman, A., & Statler, C. (2003). Novel Advanced Interconnects. In Proceedings of IMAPS 2003, 36th International Symposium on Microelectronics. Sponsored by IMAPS - International Microelectronics Packaging Society: Washington, DC (pp. 282-285).