Integrated process for defect-free copper plating and chemical-mechanical polishing of through-silicon vias for 3D interconects

Dean M. Malta; Dorota S. Temple; Christopher W. Gregory; Dean M. Malta; Christopher W. Gregory; Dorota S. Temple; Trevor Knutson; Chen Wang; Thomas Richardson; Yun Zhang; Robert Rhoades

Integrated process for defect-free copper plating and chemical-mechanical polishing of through-silicon vias for 3D interconects

Malta, D., Gregory, C., Temple, D., Knutson, T., Wang, C., Richardson, T., Zhang, Y., & Rhoades, R. (2010). Integrated process for defect-free copper plating and chemical-mechanical polishing of through-silicon vias for 3D interconects. In Electronic Component and Technology Conference, 60th (ECTC 2010) (pp. 1769 - 1775)

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