Characterization and modeling of copper TSVs for silicon interposers

John M. Lannon; John S. Lewis; Dean M. Malta; Dorota S. Temple; Matthew R. Lueck; Christopher W. Gregory; Dean M. Malta; Christopher W. Gregory; Matthew R. Lueck; John M. Lannon; John S. Lewis; Dorota S. Temple; P DiFonzo; F Naumann; Matthias Petzold

Characterization and modeling of copper TSVs for silicon interposers

Malta, D., Gregory, C., Lueck, M., Lannon, J., Lewis, J., Temple, D., DiFonzo, P., Naumann, F., & Petzold, M. (2013). Characterization and modeling of copper TSVs for silicon interposers. In Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd (pp. 2235 - 2242)

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