Electronics Research and Development
We conduct basic and applied research in the field of electronics. We develop electronic components and devices, devise novel semiconductor and insulating materials, and analyze client materials. Our engineers have developed novel ways to integrate dissimilar materials—especially active semiconductors—using wafer-bonding technology.
Capabilities
- Microfabrication and prototyping
- Electronic systems development and prototyping
- Electronic packaging and assembly
- Testing and analysis
- Design and modeling
- Materials engineering
- Photolithography with resolution to 0.5 microns
- Wet, reactive ion, and deep silicon etch
- Ion mill
- Materials deposition: spin coating, sputter deposition, CVD, e-beam evaporation, and electroplating
- High-temperature processing
- Nanoscale device processing and device architectures
Facilities and Instrumentation
- Scanning electron microscopy
- Atomic force microscopy
- X-ray photoelectron spectroscopy
- Auger electron spectroscopy
- Energy dispersive spectroscopy
- Wavelength dispersive spectroscopy
- Fourier transform infrared spectroscopy
- Ellipsometry
Feature
RTI International to Develop Novel 'Lung-on-a-Chip' RTI International was recently awarded funding to develop a 3-D in vitro cell culture that closely emulates the human lu Read more
Experts
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Dorota Temple Senior Fellow, Electronics and Energy Technologies |